Comparing PCD Die Blank Grain Sizes

Comparing PCD die blank grain sizes (3μm, 5μm, 10μm, 25μm, 50μm):

Performance Metric	3μm	5μm	10μm	25μm	50μm
‌Wear Resistance‌	★★★★☆ (Extremely High)	★★★★☆ (Very High)	★★★☆☆ (High)	★★☆☆☆ (Moderate)	★☆☆☆☆ (Lower)
‌Surface Finish‌	★★★★★ (Mirror-finish)	★★★★☆ (Exceptional)	★★★☆☆ (Excellent)	★★☆☆☆ (Average)	★☆☆☆☆ (Rough)
‌Machining Precision‌	★★★★★ (Nanometer-level)	★★★★☆ (Micron-level)	★★★☆☆ (High Precision)	★★☆☆☆ (Standard)	★☆☆☆☆ (Lower Precision)
‌Impact Resistance‌	★★☆☆☆ (Lower)	★★★☆☆ (Moderate)	★★★★☆ (Good)	★★★★★ (Excellent)	★★★★★ (Exceptional)
‌Suitable Wire Dia.‌	≤0.05mm (Ultra-fine)	0.05-0.2mm (Precision fine)	0.2-1.0mm (Medium)	1.0-5.0mm (Coarse)	≥5.0mm (Specialty coarse)
‌Wire Drawing Speed‌	★★★★★ (Ultra-high)	★★★★☆ (High)	★★★☆☆ (Medium-high)	★★☆☆☆ (Medium-low)	★☆☆☆☆ (Low)
‌Cost‌	★★★★★ (Very High)	★★★★☆ (High)	★★★☆☆ (Moderate)	★★☆☆☆ (Lower)	★☆☆☆☆ (Lowest)

 

‌Detailed Comparison

1.‌3μm (Nano-crystalline Grade)‌

Characteristics‌: Near-single crystal structure, virtually grain-boundary-free surface, hardness approaching natural diamond.

Advantages‌: Delivers mirror-finish wire surfaces; ideal for ‌gold/platinum wires‌; ultra-low friction enables ‌1,000+ m/min‌ speeds.

Limitations‌: Brittle (prone to chipping with hard inclusions); costs 5-8× more than 50μm cores.

Applications‌: Semiconductor bonding wires, medical guide wires.

2.‌5μm (Ultra-fine Grain)‌

Characteristics‌: Optimal balance of nano-level finish and practicality; industry high-end standard.

Advantages‌: Surface roughness Ra≤0.05μm for ‌USB Type-C copper wires‌; supports speeds up to ‌800 m/min‌.

Applications‌: Enameled wires, high-end electronic connectors, precision spring wires (φ0.1mm).

3.‌10μm (Fine Grain)‌

Characteristics‌: Cost-performance leader; dominates >60% market share.

Advantages‌: 20× longer lifespan than carbide dies; maintains ±0.001mm diameter tolerance; operates at ‌400-600 m/min‌.

Applications‌: Automotive harness wires (φ0.5mm), stainless welding wires (φ0.8mm).

4.‌25μm (Medium-Coarse Grain)‌

Characteristics‌: Enhanced impact resistance at the expense of surface quality.

Advantages‌: Withstands severe abrasion from ‌304 stainless steel‌; 50× lifespan vs. carbide dies.

Limitations‌: Visible wire surface texture (Ra≥0.2μm).

Applications‌: Elevator steel ropes (φ3mm), tire bead wires.

5.‌50μm (Coarse Grain)‌

Characteristics‌: Visible diamond grains; rock-like micro structure.

Advantages‌: Extreme wear/impact resistance for ‌high-carbon steel (70#)‌.

Limitations‌: Limited to wires >φ5mm; requires post-drawing polishing.

Applications‌: Mining cables, ship anchor chains.

‌Selection Guidelines

Premium Quality‌: 3-5μm for ultra-fine/high-value wires (e.g., IC bonding wires)

Cost Efficiency‌: 10μm for standard wires (φ0.3-1.0mm Cu/SS wires)

Extreme Service‌: 25-50μm for hard/coarse materials (spring steel/bead wires)

 

Note‌: Final selection must consider ‌material hardness‌ (e.g., 5μm for titanium), ‌lubrication‌ (oil lubrication boosts speed by 20%), and ‌breakage tolerance‌ (3μm mandatory for medical wires).