Common Wire Surface Defects: Causes and Die-Related Solutions
Common Wire Surface Defects: Causes and Die-Related Solutions
1. Scratches and Scores
Causes: These linear marks on the wire surface are primarily due to micro-damage inside the die hole, such as:
Abrasions or Built-up Edges (BUE): Accumulation of wire material (e.g., copper, aluminum) on the die surface, which then scratches subsequent wire.
Poor Surface Finish of the Die: Roughness in the deformation zone or bearing area.
Insufficient or Ineffective Lubrication: Leading to increased friction and direct metal-to-metal contact.
Foreign Particles: Contaminants in the lubricant or on the wire surface acting as abrasives.
Solutions from a Die Perspective:
Optimize Die Material and Coating: Utilize Polycrystalline Diamond (PCD) or advanced carbide with superior wear resistance and anti-adhesion properties.
Enhance Die Geometry: Ensure a smooth transition between the approach angle and bearing zone to facilitate proper lubricant film formation.
Improve Internal Surface Finish: Precision polishing to a mirror-like finish (e.g., Ra < 0.05 µm for fine wires) minimizes friction.
Recommend Compatible Lubrication: Advise on lubricant viscosity and additives that suit the die material and wire type.
2. Cracks
Causes: Cracks, including longitudinal or transverse fractures, often result from excessive tensile stress during drawing. Key die-related factors include:
Improper Die Geometry: An overly severe reduction angle or insufficient bearing length can cause uneven stress distribution.
Misalignment: Incorrect installation of dies or capstans, leading to asymmetric loading.
Localized Overheating: Due to high friction from poor lubrication or suboptimal die design.
Solutions from a Die Perspective:
Precise Die Design: Calculate and customize the reduction angle (e.g., 12°-16° for copper) and bearing length (typically 30%-50% of the wire diameter) based on the wire material and target reduction.
Ensure Proper Alignment: Provide guidance on die mounting and use precision die boxes to maintain concentricity.
Material Selection for High Strength: For high-tensile wires (e.g., steel alloys), recommend tougher die materials like Mono-crystal Diamond (SCD) for critical applications.
3. Bambooing
Causes: This periodic surface roughness, resembling bamboo nodes, is typically caused by:
Stick-Slip Phenomenon: Fluctuations in drawing force due to inconsistent lubrication or inadequate bearing length.
Excessive Back Tension or Fluctuating Speed: Often aggravated by a die bearing that is too short to stabilize the wire flow.
Solutions from a Die Perspective:
Optimize Bearing Zone Length: A longer bearing (e.g., 50%-70% of wire diameter for fine wires) helps dampen vibrations and ensure smooth passage.
Die Surface Hardness and Finish: Use uniformly hard materials like PCD to prevent localized deformation that contributes to stick-slip.
4. Out-of-Roundness
Causes: Deviation from circular cross-section can be attributed to:
Asymmetric Die Wear: Often due to misalignment or uneven wire structure.
Incorrect Die Geometry: Non-concentric grinding of the die hole.
Uneven Lubrication: Causing varying friction around the circumference.
Solutions from a Die Perspective:
Regular Die Inspection and Rotation: Implement a schedule to check for ovality and rotate dies in multi-hole setups to promote even wear.
Precision Manufacturing: Ensure the die hole is perfectly round and concentric with the die outer diameter through advanced CNC grinding.
Customized Designs for Shaped Wires: For non-round wires, ensure the die profile is machined with high accuracy to maintain dimensional stability.
The Critical Role of Preventive Die Maintenance
To proactively address surface defects, a robust preventive maintenance program is essential:
Routine Inspection: Use microscopes or profile projectors to examine the die bore for signs of wear, cracking, or metal buildup.
Cleaning and Storage: Properly clean dies after use to remove lubricant residues and store them in dry, contamination-free environments.
Timely Reconditioning: Establish criteria for when to polish or regrind dies (e.g., when bore size increases by 1-2% or surface roughness degrades).
Collaboration with Lubrication Management: Work with clients to monitor lubricant condition, as dirty or degraded lubricant can accelerate die damage and defect formation.
English
Español
Português
русский
français
日本語
Deutsch
Tiếng Việt
Nederlands
ไทย
Polski
한국어
Svenska
magyar
Malay
বাংলা
Dansk
Suomi
हिन्दी
Pilipino
Türk
Gaeilge
عربى
Indonesia
norsk
čeština
Ελληνικά
Українська
नेपाली
Burmese
български
ລາວ
Latine
slovenský
Lietuvos

Changzhou Shen Litong Mould invites you to visit the exhibition
From August 27th to 29th, 2025, at SHANGHAI NEW INTERNATIONAL EXPO CENTRE,the 12th China International Wire&Cable Industry Exhibition (Hall E1, G21), Shen Litong Dies sincerely invites you to visit, exchange and offer guidance, and jointly explore new developments in the industry.
Read MoreCommon Wire Surface Defects: Causes and Die-Related Solutions
Abrasions or Built-up Edges (BUE): Accumulation of wire material (e.g., copper, aluminum) on the die surface, which then scratches subsequent wire.
Read MoreThe Differences Between Aluminum Wire Drawing Dies and Copper Wire Drawing Dies.
The Differences Between Aluminum Wire Drawing Dies and Copper Wire Drawing Dies.
Read More