The Application And Differences Of Polycrystalline Dies, High-Crystalline Dies, Nano-Dies And Tungsten Steel Die

2025-07-02

The Application And Differences Of Polycrystalline Dies

The application and differences of polycrystalline dies, high-crystalline dies, nano-dies and tungsten steel dies

Parameters	Tungsten steel die	Polycrystalline die	High crystal die	Nano die
Hardness	Low (HRA 85-90)	High (second only to single crystal diamond)	Extremely high (close to single crystal)	Ultra-high (CVD coating)
Surface finish	Rough	Medium	high	Mirror level
Aperture range	Medium and small aperture	Small aperture (< 10mm)	Small aperture (< 10mm)	Wide (1.2-50mm)
Service life	Short(prone to wear)	Relatively short (prone to wear)	Medium	Extremely long (coating wear resistance)
Cost	Low	Medium	High	High (but with better cost performance)

Differences in application scenarios

1.Tungsten steel die

It is suitable for low-cost scenarios such as steel and aluminum wire drawing.

Not recommended for copper wire or high-precision requirements.

2.Polycrystalline die

Conventional wire drawing of copper and aluminum conductors, such as building cables and medium and low voltage power cables;

Batch production that requires frequent die changes.

3.High crystal mode

High-precision wires (such as ultra-fine enameled wires, precision welding wires);

Scenarios where high surface quality is required but extreme wear resistance is not necessary.

4.Nano die

High-voltage cables: Reduce burrs on conductors, prevent damage to the inner semiconductive layer, and enhance electrical performance;

High-speed wire drawing: Suitable for production lines with a speed of over 15m/s, reducing the frequency of downtime for maintenance.

Large aperture requirements: such as rail transit contact lines, forming of special-shaped conductors.